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1. product pro?le 1.1 general description 130 w ldmos power transistor for base station applications at frequencies from 2000 mhz to 2200 mhz. [1] test signal: 3gpp; test model 1; 64 dpch; par = 7 db at 0.01 % probability on ccdf per carrier; carrier spacing 10 mhz. 1.2 features n typical 2-carrier w-cdma performance at frequencies of 2110 mhz and 2170 mhz, a supply voltage of 28 v and an i dq of 1100 ma: u average output power = 30 w u power gain = 17 db (typ) u ef?ciency = 28.5 % u imd3 = - 37 dbc u acpr = - 40 dbc n easy power control n integrated esd protection n excellent ruggedness n high ef?ciency n excellent thermal stability n designed for broadband operation (2000 mhz to 2200 mhz) n internally matched for ease of use n compliant to directive 2002/95/ec, regarding restriction of hazardous substances (rohs) BLF6G22LS-130 power ldmos transistor rev. 01 23 may 2008 product data sheet table 1. typical performance rf performance at t case = 25 c in a common source class-ab production test circuit. mode of operation f v ds p l(av) g p h d imd3 acpr (mhz) (v) (w) (db) (%) (dbc) (dbc) 2-carrier w-cdma 2110 to 2170 28 30 17 28.5 - 37 [1] - 40 [1] caution this device is sensitive to electrostatic discharge (esd). therefore care should be taken during transport and handling.
BLF6G22LS-130_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 23 may 2008 2 of 11 nxp semiconductors BLF6G22LS-130 power ldmos transistor 1.3 applications n rf power ampli?ers w-cdma base stations and multi carrier applications in the 2000 mhz to 2200 mhz frequency range 2. pinning information [1] connected to ?ange. 3. ordering information 4. limiting values 5. thermal characteristics table 2. pinning pin description simpli?ed outline graphic symbol 1 drain 2 gate 3 source [1] 3 2 1 sym112 1 3 2 table 3. ordering information type number package name description version BLF6G22LS-130 - earless ?anged ldmost ceramic package; 2 leads sot502b table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v ds drain-source voltage - 65 v v gs gate-source voltage - 0.5 +13 v i d drain current - 34 a t stg storage temperature - 65 +150 c t j junction temperature - 225 c table 5. thermal characteristics symbol parameter conditions typ unit r th(j-case) thermal resistance from junction to case t case =80 c; p l = 30 w 0.43 k/w
BLF6G22LS-130_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 23 may 2008 3 of 11 nxp semiconductors BLF6G22LS-130 power ldmos transistor 6. characteristics 7. application information 7.1 ruggedness in class-ab operation the BLF6G22LS-130 is capable of withstanding a load mismatch corresponding to vswr = 10 : 1 through all phases under the following conditions: v ds =28v; i dq = 1100 ma; p l = 130 w (cw); f = 2170 mhz. table 6. characteristics t j = 25 c unless otherwise speci?ed. symbol parameter conditions min typ max unit v (br)dss drain-source breakdown voltage v gs =0v; i d = 0.5 ma 65 - - v v gs(th) gate-source threshold voltage v ds =10v;i d = 180 ma 1.4 1.9 2.4 v v gsq gate-source quiescent voltage v ds = 28 v; i d = 1100 ma 1.6 2.1 2.6 v i dss drain leakage current v gs =0v; v ds =28v - - 5 m a i dsx drain cut-off current v gs =v gs(th) + 3.75 v; v ds =10v 26.5 34 - a i gss gate leakage current v gs = 11 v; v ds = 0 v - - 450 na g fs forward transconductance v ds =10v; i d =9a - 12 - s r ds(on) drain-source on-state resistance v gs =v gs(th) + 3.75 v; i d = 6.3 a - 0.085 0.135 w c rs feedback capacitance v gs =0v; v ds =28v; f= 1mhz - 3.15 - pf table 7. application information mode of operation: 2-carrier w-cdma; par 7 db at 0.01 % probability on ccdf; 3gpp test model 1; 1-64 pdpch; f 1 = 2112.5 mhz; f 2 = 2122.5 mhz; f 3 = 2157.5 mhz; f 4 = 2167.5 mhz; rf performance at v ds = 28 v; i dq = 1100 ma; t case = 25 c; unless otherwise speci?ed; in a class-ab production test circuit. symbol parameter conditions min typ max unit p l(av) average output power - 30 - w g p power gain p l(av) = 30 w 16 17 - db rl in input return loss p l(av) = 30 w - - 9 - 6db h d drain ef?ciency p l(av) = 30 w 25.5 28.5 - % imd3 third order intermodulation distortion p l(av) = 30 w - - 37 - 34.5 dbc acpr adjacent channel power ratio p l(av) = 30 w - - 40 - 38 dbc
BLF6G22LS-130_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 23 may 2008 4 of 11 nxp semiconductors BLF6G22LS-130 power ldmos transistor 7.2 one-tone cw v ds = 28 v; i dq = 1100 ma; f = 2170 mhz. fig 1. one-tone cw power gain and drain ef?ciency as functions of load power; typical values p l (w) 0 160 120 40 80 001aai093 15 17 19 g p (db) 13 20 40 60 h d (%) 0 g p h d
BLF6G22LS-130_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 23 may 2008 5 of 11 nxp semiconductors BLF6G22LS-130 power ldmos transistor 7.3 two-tone cw v ds = 28 v; i dq = 1100 ma; f 1 = 2169.95 mhz; f 2 = 2170.05 mhz. fig 2. two-tone cw power gain and drain ef?ciency as functions of peak envelope load power; typical values v ds = 28 v; i dq = 1100 ma; f 1 = 2169.95 mhz; f 2 = 2170.05 mhz. v ds = 28 v; f 1 = 2169.95 mhz; f 2 = 2170.05 mhz. (1) i dq = 900 ma (2) i dq = 1000 ma (3) i dq = 1100 ma (4) i dq = 1200 ma (5) i dq = 1300 ma fig 3. intermodulation distortion as a function of peak envelope load power; typical values fig 4. third order intermodulation distortion as a function of peak envelope load power; typical values p l (w) 0 160 120 40 80 001aai094 15 17 19 g p (db) 13 20 40 60 h d (%) 0 g p h d p l(pep) (w) 0 250 200 100 150 50 001aai095 - 40 - 60 - 20 0 imd (dbc) - 80 imd3 imd5 imd7 p l(pep) (w) 0 250 200 100 150 50 001aai096 - 40 - 20 0 imd3 (dbc) - 60 (1) (2) (5) (3) (4)
BLF6G22LS-130_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 23 may 2008 6 of 11 nxp semiconductors BLF6G22LS-130 power ldmos transistor 7.4 2-carrier w-cdma v ds = 28 v; i dq = 1100 ma; f 1 = 2157.5 mhz; f 2 = 2167.5 mhz; carrier spacing 10 mhz. v ds = 28 v; i dq = 1100 ma; f 1 = 2169.95 mhz; f 2 = 2170.05 mhz. fig 5. 2-carrier w-cdma power gain and drain ef?ciency as functions of average load power; typical values fig 6. 2-carrier w-cdma adjacent channel leakage ratio and imd3 as functions of average load power; typical values p l (w) 050 40 20 30 10 001aai098 17 15 19 21 g p (db) 13 20 10 30 40 h d (%) 0 g p h d p l(av) (w) 040 30 10 20 001aai102 - 40 - 60 - 20 0 acpr, imd3 (dbc) - 80 imd3 acpr
BLF6G22LS-130_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 23 may 2008 7 of 11 nxp semiconductors BLF6G22LS-130 power ldmos transistor 8. test information [1] american technical ceramics type 100b or capacitor of same quality. the striplines are on a rogers ro4350b printed-circuit board (pcb) with e r = 3.48 and thickness = 0.762 mm. see t ab le 8 for list of components. fig 7. component layout for 2110 mhz to 2170 mhz test circuit for 2-carrier w-cdma 001aai108 input pcb v1 output pcb v2 c1 c2 c4 c5 r2 r1 c6 c17 c16 c3 c7 c8 c9 c10 c11 c13 c14 c15 c12 table 8. list of components (see figure 7 ) all capacitors should be soldered vertically. component description value remarks c1 multilayer ceramic chip capacitor 3.6 pf [1] c2 multilayer ceramic chip capacitor 0.3 pf [1] c3 multilayer ceramic chip capacitor 1.2 pf [1] c4 multilayer ceramic chip capacitor 4.7 pf tdk c4532x7r1e475m t020u or equivalent c5, c7, c10 multilayer ceramic chip capacitor 100 nf murata grm217br71h104ka11l or equivalent c6, c8, c11 multilayer ceramic chip capacitor 15 pf [1] c9, c12 multilayer ceramic chip capacitor 220 nf avx12065c224k c13 multilayer ceramic chip capacitor 1.3 pf [1] c14 multilayer ceramic chip capacitor 1.4 pf [1] c15 multilayer ceramic chip capacitor 24 pf [1] c16 tantalum capacitor 10 m f c17 electrolytic capacitor 220 m f; 35 v r1 chip resistor 4.7 w smd 0603 r2 chip resistor 2.7 w smd 0603
BLF6G22LS-130_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 23 may 2008 8 of 11 nxp semiconductors BLF6G22LS-130 power ldmos transistor 9. package outline fig 8. package outline sot502b references outline version european projection issue date iec jedec jeita sot502b 03-01-10 07-05-09 0 5 10 mm scale earless flanged ldmost ceramic package; 2 leads sot502b a f b d u 2 l h q c 1 3 2 d 1 e d u 1 d e 1 m m w 2 unit a mm d b 12.83 12.57 0.15 0.08 20.02 19.61 9.53 9.25 19.94 18.92 9.91 9.65 4.72 3.43 c u 2 0.25 w 2 f 1.14 0.89 u 1 20.70 20.45 l 5.33 4.32 q 1.70 1.45 ee 1 9.50 9.30 inches 0.505 0.495 0.006 0.003 0.788 0.772 d 1 19.96 19.66 0.786 0.774 0.375 0.364 0.785 0.745 0.390 0.380 0.186 0.135 0.010 0.045 0.035 0.815 0.805 0.210 0.170 0.067 0.057 0.374 0.366 h dimensions (millimetre dimensions are derived from the original inch dimensions)
BLF6G22LS-130_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 23 may 2008 9 of 11 nxp semiconductors BLF6G22LS-130 power ldmos transistor 10. abbreviations 11. revision history table 9. abbreviations acronym description 3gpp third generation partnership project ccdf complementary cumulative distribution function cw continuous wave dpch dedicated physical channel ldmos laterally diffused metal-oxide semiconductor ldmost laterally diffused metal-oxide semiconductor transistor par peak-to-average power ratio pdpch transmission power of the dedicated physical channel rf radio frequency smd surface mounted device vswr voltage standing-wave ratio w-cdma wideband code division multiple access table 10. revision history document id release date data sheet status change notice supersedes BLF6G22LS-130_1 20080523 product data sheet - -
BLF6G22LS-130_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 23 may 2008 10 of 11 nxp semiconductors BLF6G22LS-130 power ldmos transistor 12. legal information 12.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 12.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 12.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 12.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 13. contact information for more information, please visit: http://www .nxp.com for sales of?ce addresses, please send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors BLF6G22LS-130 power ldmos transistor ? nxp b.v. 2008. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 23 may 2008 document identifier: BLF6G22LS-130_1 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 14. contents 1 product pro?le . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 thermal characteristics. . . . . . . . . . . . . . . . . . . 2 6 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 application information. . . . . . . . . . . . . . . . . . . 3 7.1 ruggedness in class-ab operation. . . . . . . . . . 3 7.2 one-tone cw . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.3 two-tone cw . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.4 2-carrier w-cdma . . . . . . . . . . . . . . . . . . . . . . 6 8 test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 legal information. . . . . . . . . . . . . . . . . . . . . . . 10 12.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 12.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 13 contact information. . . . . . . . . . . . . . . . . . . . . 10 14 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

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